Note: according to user requirements of nano particle can provide different size products.

Product performance

       Our company sells the Nano-aluminium nitride powder purity is high, the particle size is small, is bigger than the surface area, the surface activity is high, through the superficial cloth wrapper processing powder body, the oxygen content is extremely low (<0.1%), the insulation heat conduction performance effect is obvious. Should accept the rice noodle body to be possible to apply in the engineering plastics, enhances the betterment work plastic the performance and the mechanical strength and so on, good injection molding performance. Uses in the compound materials, is good with the semiconductor silicon match, the contact surface compatibility is good, may enhance the compound materials the mechanical property and the heat conduction insulating ability, widely applies the heat conduction silica gel and the heat conduction plastic, the resin, the LED electron seal material.

Application direction

       1 Manufacture integrated circuit foundation plate, the electronic device, the optical device, the radiator, the high temperature crucible prepares metal-based and the high score subbasis compound materials, specially enhances the material in the high temperature sealing compound and in the electronic seal material the heat dispersion and the intensity characteristic, has the extremely good application prospect, may substitute for the present import a micron aluminium nitride;

       2 Heat conduction silica gel and heat conduction epoxy resin: A nanometer aluminium nitride which produces with Our company prepares the superelevation heat conduction silica gel, it has the good thermal conductivity, good overcharge insulating property, wide electric insulation and application temperature (operating temperature - 80-250℃), low thickness and good construction performance. The product has reached or surpasses the imported product, because may substitute for the similar imported product, but widely applies in electronic device’s heat transfer medium, raises the working efficiency. If CPU and radiator crack, high efficiency triode, silicon-controlled rectifier part, diode, with parent metal contact fine drawn place heat transfer medium. The nanometer heat conduction paste is between packing IC or the triode and radiator fin’s crevice, increases between them the contacted area, achieves the better radiation effect;